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Micrel, Inc.
MICRF213
PCB Considerations and Layout
connection.
Do
not
share
vias
with
ground
Figure 11 through 16 show some of the printed circuit
layers for the QR211HE1 board. The MICRF213
shares the exact same board with different component
values. Use the Gerber files provided (downloadable
from Micrel Website: www.micrel.com) which have the
remaining layers needed to fabricate this board. When
copying or making one’s own boards, be sure and
make the traces as short as possible. Long traces
alter the matching network and the values suggested
are no longer valid. Suggested Matching Values may
vary due to PCB variations. A PCB trace 100 mills
(2.5mm) long has about 1.1nH of inductance.
Optimization should always be done with exhaustive
range tests. Make individual ground connections to
connections. Each ground connection = 1 via or more
vias. Ground plane must be solid and possibly without
interruptions. Avoid ground plane on top next to the
matching elements. It normally adds additional stray
capacitance which changes the matching. Do not use
phenolic material, only FR4 or better materials.
Phenolic material is conductive above 200MHz. The
RF path should be as straight as possible avoiding
loops and unnecessary turns. Separate ground and
VDD lines from other circuits (microcontroller, etc).
Known sources of noise should be laid out as far as
possible from the RF circuits. Avoid thick traces, the
higher the frequency, the thinner the trace should be
in order to minimize losses in the RF path.
the ground plane with a via for each ground
Figure 11. QR211/213HE1 Top Layer
Figure 12. QR211/213HE1 Bottom Layer, Mirror Image
May 2007
13
M9999-052307-A
(408) 944-0800
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